Mitsubishi IGBT CM200DY12H
Mitsubishi IGBT Modules are designed for use in switching applications.Each module consists of two IGBTs in a half-bridge configuration with each transistor having a reverse-connected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.
Features :
Power Device Junction Temperature : – Module Weight (Typical) : 270 Grams Isolation Voltage (Main Terminal to Baseplate, AC 1 min.) : 2500 Vrms Low Drive Power Low VCE(sat) Discrete Super-Fast Recovery Free-Wheel Diode High Frequency Operation Isolated Baseplate for Easy Heat Sinking
Applications :
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